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Acid Copper Plating Processes A 'ONE STOP' SHOP FOR COPPER PLATINGCopper electrodeposition has a wide variety of application in metal finishing industry. It serves as an undercoat of various substrates such as nickel-chrome electrodeposits, aluminium, zinc diecasting, ABS plastic, etc,. It also acts as a base for oxidized or coloured finishes. Electroforming of precision components and moulds is also possible. Thick deposits applied to steel as a stop of coating in case of hardening process. BRIGHT COPPERCuprobrite
- Unique aqueous dye based copper plating process
- High degree of brightness & levelling at short plating time
- Uniform levelling on all current density
- Operates at lower dosage
Cupracid
- Produces highly levelled, brilliant, smooth & ductile deposits
- Bright finish with minimum thickness
- Higher covering & throwing power
- Superb brightening ability
- Specially designed for decorative plating on metal and plastic
HIGH SPEED COPPERCuprobrac
- Newly developed process differing from conventional system with top-of-the levelling property ~ even > 95%
- Superb adhesion between copper & nickel plating ~ ideal choice for plating on plastics
- 'Trouble free' operation
- Excellent HCD & LCD coverage
- Lower in consumption ~ hence lower cost
- Stable plating bath ~ no build up of harmful decomposed matters
HIGH BUILD COPPER
Cuprabuild
- Produces a micro-crystalline semi bright & smooth deposit
- Excellent leveling ability with uniform thickness Can be operated at higher current density ~ up to 200 Amp/sq ft. is possible
- Specially utilized in the plating of printing cylinders
- Deposit hardness ~ 120 VPN
DISCLAIMER: Our recommendations are made in good faith and are based on our skills. However, since the conditions of use of these products are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.
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